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Press Release

Case Study


January 17, 2007

 


Fujitsu and Hopling Technologies to Ship Linux WiMAX Board Packages

Original Design Manufacturers are First to Utilize Innovative and Open Support Packages;
Case Study of Hopling Technologies’ Unique Mesh Architecture Now Available

Sunnyvale, Calif., USA,  Langen, Germany and Almere, the Netherlands, January 17, 2007 – Fujitsu Microelectronics America, Inc. (FMA), Fujitsu Microelectronics Europe (FME), and Hopling Technologies announced today that they will ship their jointly-produced Linux-based WiMAX baseband system-on-chip (SoC) reference kits to ODM customers.

Hopling Technologies and Fujitsu announced in September 2006 (
see a related press release announced on September 6, 2006) that they would collaborate on a Linux-based Hopling Board Support Package designed to make it easier for equipment manufacturers to add innovative applications to the standards-based Fujitsu solution. The reference kit, which includes a reference board utilizing the highly integrated MB87M3550 WiMAX SoC, software package and operating manual, will be available from Fujitsu in 1Q-2007.

“This reference kit very effectively leverages Hopling Technologies’ software and Fujitsu's SoC,” stated Manfred Mettendorff, U.S. based senior marketing manager for Fujitsu Microelectronics Europe. “Fujitsu is the first company to address the growing need for embedding WiMAX baseband SoC into our customers’ Linux-based wireless equipment. We believe this will spur development worldwide and decrease time-to-market for our customers’ products.”

“Hopling Technologies is deeply committed helping businesses across the world realize the benefit and full potential of WiMAX," said Ivo van Ling, Chief Technology Officer of Hopling Technologies. "This joint Linux project with Fujitsu is an extremely important project and it's a milestone in Hopling Technologies’ WiMAX product strategy that will allow companies to roll out seamless broadband wireless systems.”

“The shipping of the Linux WiMAX Board Packages is a successful outcome of the expanded relationship of Hopling Technologies and Fujitsu,” stated Rudger van Brenk, who was recently appointed Director Research and added to the Leadership Team of Hopling Technologies. “Together, we have managed to develop a product that is state-of-the-art and future-proof for companies wishing to launch their own WiMAX product-line.”

Additional information about the topology and applications served by Hopling Technologies Wireless Broadband Access solutions, and its direction on fixed and mobile WiMAX architectures, can be found in the newly-published Hopling Technologies Case Study, available at:

http://www.fujitsu.com/us/services/edevices/microelectronics/broadbandwireless/case/


 



 



About Fujitsu Microelectronics America, Inc.

Fujitsu Microelectronics America, Inc. (FMA) leads the industry in innovation. Fujitsu provides high-quality, reliable semiconductor products and services for the networking, communications, automotive, security and other markets throughout North and South America. As a founding member and current board member of the WiMAX Forum™, Fujitsu supports the standards development and compliance programs that are essential to successful Broadband Wireless deployment. Fujitsu provides performance-driven WiMAX solutions by leveraging the company's experience and expertise in the networking and communications markets. Fujitsu offers flexible WiMAX SoC and reference designs for WiMAX-certifiable systems to equipment vendors.

About Fujitsu Microelectronics Europe
Fujitsu Microelectronics Europe (FME) is a major supplier of semiconductor products. The company provides advanced systems solutions to the automotive, digital TV, mobile telephony, networking and industrial markets. Engineers from design centres dedicated to microcontrollers, mixed-signal, wireless, FRAM, multi-media ICs and ASIC products work closely with FME´s marketing and sales teams throughout Europe to help satisfy customers´ system development requirements. This solutions approach is supported by a broad range of advanced semiconductor devices, IP and building blocks as well as leading-edge Plasma Display Panels.